Job description:

Role Summary:We are seeking a Senior Package Design Engineer to join our custom SOC/ASIC development client. Youll work closely with cross-functional teams in the U.S. and overseas on high-performance package substrate design with a focus on signal/power integrity and routing.

Key Responsibilities:

• Perform package substrate design and analysis (SI/PI/routing)
• Collaborate with layout engineers, marketing, and global design teams
• Use tools like HFSS, ADS for package modeling/simulation
• Contribute during pre/post-sales processes

Qualifications:

Qualifications:

• BS in EE or related field; MS preferred
• 810 years of experience in semiconductor package design
• Strong SI/PI analysis, modeling, and simulation skills
• Excellent communication, teamwork, and presentation abilities

Preferred Skills:

• Expertise in high-speed package/PCB design (SerDes, PCIe, LPDDR, Ethernet)
• Time/frequency domain analysis, impedance, jitter, eye-diagram, BER analysis
• Experience with Hspice, Redhawk, electro-thermal simulation, PDN modeling
• Familiarity with reliability analysis and packaging/assembly rules

Why is This a Great Opportunity:

outstanding technology, great opportuity to learn. Growing company with a lot of IP. Everyone contributes.

Salary Type : Annual Salary

Salary Min : $ 190000

Salary Max : $ 220000

Currency Type : USD